>> General Specifications
| CC4 (NPO,COG) |
CT4 (X7R) |
CT4 (Y5V,Z5U) |
| Capacitance Range |
0.5pF~104 |
221~225 |
103~106 |
| Capacitance Tolerance |
B=±0.1pF |
C=±0.25pF |
K=±10% |
M=±20% |
| D=±0.5pF |
F=±1% |
M=±20% |
S=+50%~-20% |
| G=±2% |
J=±5% |
S=+50%~-20% |
Z=+80%~-20% |
| K=±10% |
M=±20% |
|
P=+100%~0 |
| B,C,D for C <10pF |
|
|
| Rated Voltage |
25V, 50V, 100V, 200V, 500V, 1000V
2000V,3000V, 4000V |
25V, 50V, 100V
200V, 250V |
| Dissipation Factor(DF) |
0.15%Max |
2.5%Max |
5.0%Max |
| (20℃,1MHZ,1VDC) |
(20℃,1KHZ,1VDC) |
(20℃,1KHZ,0.3VDC) |
| Insulation Resistance |
C≤10nF |
IR≥10000MΩ |
C≤25nF |
IR≥4000MΩ |
| C>10nF |
IR>500Ω.F |
C>25nF |
C×R>100ΩF |
| Dielectric With Standing Voltage |
There shall be no evidence of damage or flash over during the test. |
| Termination adhesion strength |
There shall be no evidence of damage or flash over during the test. |
| Bending Strength |
There shall be no evidence of damage or flash over during the test, capacitance tolerance shall be not more than 10%. |
| Solderability |
Time: |
2±1s |
| Temp.: |
235±5℃ |
| Cover: |
≥ 95% |
|
Resistance to Soldering Heat
|
Time: |
5±1s |
| Temp.: |
265±5℃
|
| Cover: |
≥ 95% |
| △C/C: |
≤0.5% or 0.5pF |
≤-5% ~ +10% |
≤-10% ~ +20% |
|
Temperature cycling
|
△C/C: |
≤1% |
≤± 10% |
≤±30% |
| Outlook: |
There shall be no evidence of damage or flash over during the test. |
|
Humidity Moisture Resistance
|
△C/C: |
≤2% |
≤10% |
≤20% |
|
DF
|
0.003 |
0.05 |
0.07 |
| IR |
R×C>25s |
| Outlook: |
There shall be no evidence of damage or flash over during the test. |
|
T.C. Characteristics (△C/C)
|
±30ppm/℃ |
±15% |
Z5U(E) |
+22~-56% |
| Y5V(F) |
+22~-82% |
|
Vibration
|
Outlook: |
There shall be no evidence of damage or flash over during the test. |
|
Bump
|
△C/C:
|
≤2% |
| Outlook: |
There shall be no evidence of damage or flash over during the test. |
|
Life test (1000hours)
|
△C/C: |
≤2% |
≤±12.5% |
≤±30.0% |
| DF |
0.003 |
0.05 |
| IR |
R×C>25s |
R×C≥25s |
| Outlook: |
There shall be no evidence of damage or flash over during the test. |
| |